| ◆ |
Designed
for the following processors : |
| |
Intel
Pentium III Tualatin, all CuMine and Celeron
processors family.
AMD Athlon 1.6 GHz and beyond.
AMD Athlon XP 2300 and beyond.
AMD all Duron processors family.
|
| ◆ |
The
patented design of a "multi-channel wind
tunnel".
|
| ◆ |
The
copper core faster and more intensive transfer heat
from processor to aluminum heat sink.
|
| ◆ |
3D-isotropy
thermal conductive path. |
| ◆ |
Two
kind of different metal materials made precision
combination. |
| ◆ |
Patent
clip of hinge cross vertically on processor. |
| ◆ |
Air
flow directly cross into heat sink "multi-channel
wind tunnel". |
| ◆ |
The
application of a CPU protection cushion with the
functions of "shaking absorption and breakage
proof". |
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